Presentation
| Product range | CT80 |
| Product type | BGA Balls |
Sale package
| Pack | Bulk |
| Content | BGA Balls |
| Product status | New |
Lanrui CT80 BGA Balls
The Lanrui CT60 BGA balls represent the professional and high-precision solution ideal for repairing and maintaining the pads on Android phone motherboards.
This remarkable set provides you with 25,000 perfectly spherical solder balls, ensuring
complete uniformity in size and consistent performance during delicate servicing processes for touchscreens or chips.
Manufactured according to top industrial standards, the balls stand out with an extremely strict tolerance of only 8 microns,
far exceeding the usual market standard and offering flawless coverage for each individual pad.
The eco-friendly metal material contains special trace elements that enhance solder quality,
and the native antistatic properties protect sensitive electronic components
against accidental electrical discharges.
